大数据分析
国际会议

2018 IEEE 3rd International Conference on Big Data Analysis (ICBDA 2018)
2018年第三届大数据分析国际会议
March 9-12, 2018 | Shanghai, China (2018年3月9-12日 | 中国,上海)

Welcome to ICBDA2018

March 9-12, 2018 | Shanghai, China
2018.3.9-12 中国,上海

Big Data overall architecture consists of three layers: data storage, data processing and data analysis. Data storage layer stores complex type and mass data, data processing layer realizes real-time processing of massive data, and only through data analysis layer, smart, in-depth and valuable information are got. When talking about big data, it comes to the first is 4V characteristics of big data, namely Volumes, Variety ,Velocity , Veracity. Big data processing key technology generally includes: data acquisition, data preprocessing, data storage and data management, data analysis and mining, big show and application (big data retrieval, data visualization, big data applications, data security, etc.).

In recent years, “Big Data” has become a new ubiquitous term. Big Data is transforming science, engineering, medicine, healthcare, finance, business, and ultimately society itself. The 2018 IEEE 3rd International Conference on Big Data Analysis (ICBDA 2018) provides a leading forum for disseminating the latest research in Big Data Research, Development, and Application.

“Big data”(大数据)时代已经来临 

我国已全面迈入4G时代,大数据、云计算等产业关键技术演进和应用创新加速发展,产业支持政策规划纷纷出台,数据开放共享机制不断推进,产业发展基础环境初步具备,产业生态体系逐步完善建立,大数据产业将进入理性发展、落地应用阶段,并有望在通信、互联网、金融、医疗等重点行业率先取得突破,将成为全球最重要的大数据市场。大数据带来了全新的变革与机遇,但我国大数据产业还处于发展初期,总体战略规划仍有待部署,行业标准化和规模化应用还未实现,核心技术和数据资源开放有待突破,行业协作和商业模式瓶颈尚待解决,数据安全与隐私保护形势严峻等诸多挑战。  

为了迎接大数据时代的到来,更好地交流大数据的实践经验,进一步推进大数据技术创新与应用,展示国内外大数据领域的最新科研成果。 2018年第三届大数据分析国际会议将于2018年3月9日-12日在中国上海召开。 会议旨在促进大数据分析等领域的学术交流与合作,热忱欢迎从事相关技术研究的专家、学者和专业技术人员踊跃投稿并参加大会。


Proceedings

After a careful reviewing process, all accepted papers after proper registration and presentation, will be published in the ICBDA 2018 conference Proceedings, and reviewed by the IEEE Conference Publication Program for IEEE Xplore Ei Compendex and Scopus.

会议论文集将提交由IEEE出版并检索。 文章作者将被邀请参会做口头报告。

ICBDA2016 has been included in the IEEE Xplore! | ICBDA2016 已进入IEEE Xplore 数据库(Read More)
Papers of ICBDA2016 are indexed by Ei Compendex and Scopus! | ICBDA2016论文集已被Ei核心检索和Scopus收录!(Read More)

 

 
ICBDA2017 Group Photo   ICBDA2017 Proceedings-Cover 

Speakers
Prof. CAO JIANNONG
The Hong Kong Polytechnic University, Hong Kong
(香港理工大学) 
Prof. Hayato YAMANA
Waseda University, JAPAN 
Prof. Hongwei Du 
California State University, East Bay, USA 
(加州州立大学东湾校区)

Prof. Neil Bergmann
University of Queensland, Australia

Prof. Nen-Fu Huang
(黄能富教授)

National Tsing Hua University, Taiwan
       
Assoc. Prof. Simon Fong
University of Macau, Macau 

Submission Methods

1.Full Paper
(Presentation and Publication)

Accepted full paper will be invited to give the oral presentation at the conference and be published in the conference proceedings. Read more

2. Abstract
(Presentation only)

Accepted abstract will be invited to give the presentation at the conference, the presentation will not be published. Read more

Methods

Please log in the Electronic Submission System; ( .pdf only) to submit your full paper and abstract.

For any inquiry about the conference, please feel free to contact us at: icbda2016@vip.163.com.

Important Dates


Submission Deadline
投稿截止日期 
November 05, 2017
2017年11月05日
 
Notification Date
录用通知日期
December 05, 2017
2017年12月05日 
Registration Deadline
注册截止日期
December 25, 2017
2017年12月25日 
Conference Dates
会议日期
March 9-12, 2018
2018年03月9-12日

What's News (Read More)

21
Sept.

Good News

Welcome Assoc. Prof. Simon Fong from University of Macau, Macau give Plenary Speech at conference!  (Read More)

23
Aug.

Good News

Welcome Prof. CAO JIANNONG from The Hong Kong Polytechnic University, Hong Kong give Keynote Speech at conference! (Read More)

11
July

Good News

Welcome Prof. Neil Bergmann from University of Queensland, Australia give Plenary Speech at conference! (Read More)

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